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A800LS

The miniaturized layout design of A800LS allows maintenance and other operations to be carried out in the gray area, saving clean room space. The corresponding maintenance operations are simpler, with fewer consumables used, meeting the high repeatability and high reliability coating requirements for industrialization.

Overview

The miniaturized layout design of A800LS allows maintenance and other operations to be carried out in the gray area, saving clean room space. The corresponding maintenance operations are simpler, with fewer consumables used, meeting the high repeatability and high reliability coating requirements for industrialization.

Industrialized design for the LED industry, compatible with various sizes of wafers

Advanced PLC control system compatible with Industry 4.0

High accuracy process control

Shorter ALD cycle time and less precursor source consumption

Highest production, lowest production consumption

Optimal film uniformity and repeatability

Feature and advantage

Substrate

4/6-inch standard wafer can hold up to 150/50 chips

Process temperature

70℃ – 300℃

Deposited film

Al2O3 film: standard configuration for aluminum source and water source location, optional with precursor sources such as ozone

ALD performance

Large loading capacity and short coating time

Better than 1.0% film uniformity(1σ, 5mmEE).

Highly competitive equipment performance and film uniformity

Conformal coverage >94%

Continuous non pinhole alumina barrier film with superior water vapor barrier can greatly improve the lifespan of Mini LED; And the thin film has high breakdown voltage performance

Emi level high-precision film thickness controllability and high production reliability

Loading method

Manual loading

Semi-automatic loading

Fully automatic loading

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